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1. general description the 74abt125 high-performance bicmos device combines low static and dynamic power dissipation with high sp eed and high output drive. the 74abt125 device is a quad buffer that is ideal for driving bus lines. the device features four output enables (1oe , 2oe , 3oe , 4oe ), each controlling one of the 3-state outputs. 2. features and benefits ? quad bus interface ? 3-state buffers ? live insertion and extraction permitted ? output capability: high ? 32 ma; low +64 ma ? power-up 3-state ? inputs are disabled during 3-state mode ? latch-up protection exceeds 500 ma per jesd78 class ii level a ? esd protection: ? hbm jesd22-a114e exceeds 2000 v ? mm jesd22-a115-a exceeds 200 v 3. ordering information 74abt125 quad buffer; 3-state rev. 6 ? 3 november 2011 product data sheet table 1. ordering information type number package temperature range name description version 74ABT125N ? 40 ? c to +85 ? c dip14 plastic dual in-line package; 14 leads (300 mil) sot27-1 74abt125d ? 40 ? c to +85 ? c so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1 74abt125db ? 40 ? c to +85 ? c ssop14 plastic shrink small outline package; 14 leads; body width 5.3 mm sot337-1 74abt125pw ? 40 ? c to +85 ? c tssop14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402-1 74abt125bq ? 40 ? c to +85 ? c dhvqfn14 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 ? 3 ? 0.85 mm sot762-1
74abt125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 6 ? 3 november 2011 2 of 16 nxp semiconductors 74abt125 quad buffer; 3-state 4. functional diagram 5. pinning information 5.1 pinning fig 1. logic symbol fig 2. iec logic symbol fig 3. logic diagram (one buffer) mna228 1a 1y 2 1 3 1oe 2a 2y 5 4 6 2oe 3a 3y 9 10 8 3oe 4a 4y 12 13 11 4oe mna229 1 en1 1 3 2 4 6 5 10 8 9 13 11 12 mna227 noe na ny (1) this is not a supply pin. the substrate is attached to this pad using conductive die atta ch material. there is no electrical or mechanical requi rement to solder this pad. however, if it is soldered, the solder land should remain floating or be connected to gnd. fig 4. pin configuration dip14, so14 and (t )ssop14 fig 5. pin co nfiguration dhvqfn14 74abt125 1oe v cc 1a 4oe 1y 4a 2oe 4y 2a 3oe 2y 3a gnd 3y 001aai027 1 2 3 4 5 6 7 8 10 9 12 11 14 13 001aai028 74abt125 transparent top view 2y 3a 2a 3oe 2oe 4y 1y 4a 1a 4oe gnd 3y 1oe v cc 6 9 5 10 4 11 3 12 2 13 7 8 1 14 terminal 1 index area gnd (1)
74abt125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 6 ? 3 november 2011 3 of 16 nxp semiconductors 74abt125 quad buffer; 3-state 5.2 pin description 6. functional description [1] h = high voltage level; l = low voltage level; x = don?t care; z = high-impedance off-state. 7. limiting values [1] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] the performance capability of a high-perfo rmance integrated circuit in conjunction with its thermal environment can create j unction temperatures which are detrimental to reliability. [3] so14 packages: above 70 ? c p tot derate linearly with 8 mw/k ssop14 and tssop20 packages: above 60 ? c p tot derate linearly with 5.5 mw/k dhvqfn14 packages: above 60 ? c p tot derate linearly with 4.5 mw/k table 2. pin description symbol pin description 1oe to 4oe 1, 4, 10, 13 output enable input (active low) 1a to 4a 2, 5, 9, 12 data input 1y to 4y 3, 6, 8, 11 data output gnd 7 ground (0 v) v cc 14 supply voltage table 3. function selection [1] inputs output noe na ny lll lhh hxz table 4. limiting values [1] in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +7.0 v v i input voltage ? 1.2 +7.0 v v o output voltage output in off-state or high-state ? 0.5 +5.5 v i ik input clamping current v i < 0 v ? 18 - ma i ok output clamping current v o < 0 v ? 50 - ma i o output current output in low-state - 128 ma t j junction temperature [2] -150 ?c t stg storage temperature ? 65 +150 ?c p tot total power dissipation t amb = ? 40 ? c to +85 ?c [3] -500mw
74abt125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 6 ? 3 november 2011 4 of 16 nxp semiconductors 74abt125 quad buffer; 3-state 8. recommended operating conditions 9. static characteristics table 5. operating conditions voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage 4.5 5.5 v v i input voltage 0 v cc v v ih high-level input voltage 2.0 - v v il low-level input voltage - 0.8 v i oh high-level output current ? 32 - ma i ol low-level output current - 64 ma ? t/ ? v input transition rise and fall rate - 10 ns/v t amb ambient temperature in free air ? 40 +85 ?c table 6. static characteristics symbol parameter conditions 25 ?c ? 40 ? c to +85 ?c unit min typ max min max v ik input clamping voltage v cc = 4.5 v; i ik = ? 18 ma - ? 0.9 ? 1.2 - ? 1.2 v v oh high-level output voltage v i = v il or v ih v cc = 4.5 v; i oh = ? 3 ma 2.5 2.9 - 2.5 - v v cc = 5.0 v; i oh = ? 3 ma 3.0 3.4 - 3.0 - v v cc = 4.5 v; i oh = ? 32 ma 2.0 2.4 - 2.0 - v v ol low-level output voltage v cc = 4.5 v; i ol =64ma; v i =v il or v ih - 0.35 0.55 - 0.55 v i i input leakage current v cc = 5.5 v; v i =gndor 5.5v - ? 0.01 ? 1.0 - ? 1.0 ? a i off power-off leakage current v cc = 0.0 v; v i or v o ? 4.5 v - ? 5.0 ? 100 - ? 100 ? a i o(pu/pd) power-up/power-down output current v cc = 2.1 v; v o =0.5v; v i =gndor v cc ; oe = don?t care [1] - ? 5.0 ? 50 - ? 50 ? a i oz off-state output current v cc = 5.5 v; v i = v il or v ih v o = 2.7 v - 1.0 50 - 50 ? a v o = 0.5 v - ? 1.0 ? 50 - ? 50 ? a i lo output leakage current high-state; v o =5.5v; v cc =5.5v; v i =gndor v cc -5.050 - 50 ? a i o output current v cc = 5.5 v; v o = 2.5 v [2] ? 50 ? 100 ? 180 ? 50 ? 180 ma i cc supply current v cc = 5.5 v; v i = gnd or v cc outputs high-state - 65 250 - 250 ? a outputs low-state - 12 15 - 30 ma outputs disabled - 65 250 - 50 ? a
74abt125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 6 ? 3 november 2011 5 of 16 nxp semiconductors 74abt125 quad buffer; 3-state [1] this parameter is valid for any v cc between 0 v and 2.1 v, with a transition time of up to 10 ms. from v cc = 2.1 v to v cc = 5 v ? 10 %, a transition time of up to 100 ? s is permitted. [2] not more than one output should be tested at a time, and the duration of the test should not exceed one second. [3] this is the increase in supply current for each input at 3.4 v. 10. dynamic characteristics ? i cc additional supply current per control pin; v cc = 5.5 v; one control input at 3.4 v, other inputs at v cc or gnd [3] outputs enabled - 0.5 1.5 - 1.5 ma outputs disabled - 50 250 - 250 ma one enable input at 3.4 v and other inputs at v cc or gnd; outputs disabled - 0.5 1.5 - 1.5 ma c i input capacitance v i = 0 v or v cc -4- - -pf c o output capacitance outputs disabled; v o =0v orv cc -7- - -pf table 6. static characteristics ?continued symbol parameter conditions 25 ?c ? 40 ? c to +85 ?c unit min typ max min max table 7. dynamic characteristics gnd = 0 v. test circuit is shown in figure 8 . symbol parameter conditions 25 ?c; v cc = 5.0 v ? 40 ? c to +85 ?c; v cc = 5.0 v ? 0.5 v unit min typ max min max t plh low to high propagation delay na to ny, see figure 6 1.0 2.8 4.1 1.0 4.6 ns t phl high to low propagation delay na to ny; see figure 6 1.0 3.1 4.6 1.0 4.9 ns t pzh off-state to high propagation delay noe to ny; see figure 7 1.0 3.2 5.0 1.0 5.9 ns t pzl off-state to low propagation delay noe to ny; see figure 7 1.0 4.2 6.2 1.0 6.8 ns t phz high to off-state propagation delay noe to ny; see figure 7 1.0 4.1 5.4 1.0 6.2 ns t plz low to off-state propagation delay noe to ny; see figure 7 1.5 2.8 5.0 1.5 5.5 ns
74abt125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 6 ? 3 november 2011 6 of 16 nxp semiconductors 74abt125 quad buffer; 3-state 11. waveforms v m =1.5v v ol and v oh are typical voltage output levels that occur with the output load. fig 6. propagation delay input (na) to output (ny) mna230 t phl t plh v m v m na input ny output gnd v i v oh v ol v m =1.5v v ol and v oh are typical voltage output levels that occur with the output load. fig 7. enable and disable times 001aal294 t plz t phz outputs disabled outputs enabled v oh ? 0.3 v v ol + 0.3 v outputs enabled output low-to-off off-to-low output high-to-off off-to-high noe input v i v ol v oh 3.5 v v m v m gnd gnd t pzl t pzh v m v m
74abt125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 6 ? 3 november 2011 7 of 16 nxp semiconductors 74abt125 quad buffer; 3-state a. input pulse definition b. test circuit test data is given in table 8 . test circuit definitions: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to output impedance z o of the pulse generator. v ext = test voltage for switching times. fig 8. load circuitry for switching times 001aai298 v m v m t w t w 10 % 90 % 90 % 0 v v i v i negative pulse positive pulse 0 v v m v m 90 % 10 % 90 % 10 % 10 % t f t r t r t f v ext v cc v i v o mna616 dut c l r t r l r l g table 8. test data input load v ext v i f i t w t r , t f c l r l t phl , t plh t pzh , t phz t pzl , t plz 3.0 v 1 mhz 500 ns ? 2.5 ns 50 pf 500 ? open open 7.0 v
74abt125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 6 ? 3 november 2011 8 of 16 nxp semiconductors 74abt125 quad buffer; 3-state 12. package outline fig 9. package outline sot27-1 (dip14) unit a max. 1 2 (1) (1) b 1 cd (1) z ee m h l references outline version european projection issue date iec jedec jeita mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot27-1 99-12-27 03-02-13 a min. a max. b max. w m e e 1 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2.2 4.2 0.51 3.2 0.068 0.044 0.021 0.015 0.77 0.73 0.014 0.009 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.087 0.17 0.02 0.13 050g04 mo-001 sc-501-14 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 14 1 8 7 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. dip14: plastic dual in-line package; 14 leads (300 mil) sot27-1
74abt125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 6 ? 3 november 2011 9 of 16 nxp semiconductors 74abt125 quad buffer; 3-state fig 10. package outline sot108-1 (so14) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot108-1 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 7 8 1 14 y 076e06 ms-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale so14: plastic small outline package; 14 leads; body width 3.9 mm sot108-1
74abt125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 6 ? 3 november 2011 10 of 16 nxp semiconductors 74abt125 quad buffer; 3-state fig 11. package outline sot337-1 (ssop14) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.25 0.2 7.9 7.6 1.03 0.63 0.9 0.7 1.4 0.9 8 0 o o 0.13 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot337-1 99-12-27 03-02-19 (1) w m b p d h e e z e c v m a x a y 1 7 14 8 a a 1 a 2 l p q detail x l (a ) 3 mo-150 pin 1 index 0 2.5 5 mm scale ssop14: plastic shrink small outline package; 14 leads; body width 5.3 mm sot337-1 a max. 2
74abt125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 6 ? 3 november 2011 11 of 16 nxp semiconductors 74abt125 quad buffer; 3-state fig 12. package outline sot402-1 (tssop14) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.72 0.38 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot402-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 17 14 8 a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402-1 a max. 1.1 pin 1 index
74abt125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 6 ? 3 november 2011 12 of 16 nxp semiconductors 74abt125 quad buffer; 3-state fig 13. package outline sot762-1 (dhvqfn14) terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 3.1 2.9 d h 1.65 1.35 y 1 2.6 2.4 1.15 0.85 e 1 2 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot762-1 mo-241 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot762-1 dhvqfn14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 26 13 9 8 7 1 14 x d e c b a 02-10-17 03-01-27 terminal 1 index area ac c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1)
74abt125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 6 ? 3 november 2011 13 of 16 nxp semiconductors 74abt125 quad buffer; 3-state 13. abbreviations 14. revision history table 9. abbreviations acronym description bicmos bipolarcmos dut device under test esd electrostatic discharge hbm human body model mm machine model table 10. revision history document id release date data sheet status change notice supersedes 74abt125 v.6 20111103 product data sheet - 74abt125 v.5 modifications: ? legal pages updated 74abt125 v.5 20101124 product data sheet - 74abt125 v.4 74abt125 v.4 20100427 product data sheet - 74abt125 v.3 74abt125 v.3 20080429 product data sheet - 74abt125 v.2 74abt125 v.2 19980116 product specification - 74abt125 v.1 74abt125 v.1 19960305 - - -
74abt125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 6 ? 3 november 2011 14 of 16 nxp semiconductors 74abt125 quad buffer; 3-state 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 15.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 15.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
74abt125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 6 ? 3 november 2011 15 of 16 nxp semiconductors 74abt125 quad buffer; 3-state non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 15.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 16. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors 74abt125 quad buffer; 3-state ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 3 november 2011 document identifier: 74abt125 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 functional description . . . . . . . . . . . . . . . . . . . 3 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 recommended operating conditions. . . . . . . . 4 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 4 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 5 11 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 15 legal information. . . . . . . . . . . . . . . . . . . . . . . 14 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 15.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16 contact information. . . . . . . . . . . . . . . . . . . . . 15 17 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

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